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FR4 CEM-1 1.6 mm PCB Board Layout HASL Finished UL RoHs OEM Service

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Shenzhen Zhong Yi Xin Circuit Co,. ltd.

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Place of Origin : China

Brand Name : ZYX

Certification : UL, CE, RoHs, REACH, SGS

Model Number : ZYX

MOQ : 10 PCS

Price : Negotiate

Packaging Details : Plastic bag + bubble packaging

Delivery Time : 5-7 DAYS

Payment Terms : L/C,T/T, Paypal, West Union

Supply Ability : 1 Million PCS Per Month

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FR4 CEM-1 1.6 mm PCB Board Layout HASL Finished UL RoHs OEM Service

Description:

Best service with quick response is always provided for our customers.
Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
Quality guarantee and professional after-sale service.
All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
BGA,Blind&Buried Vias and Impedence Control is accepted.
Gerber file needed.

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	2-Layer
Board Thickness	1.6mm
Copper Thickness	1.0oz
Surface Finish	HASL
Solder Mask	GREEN
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
Process Engineering	Items	Manufacturing Capability
Laminate	Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
	Internal width/spacing	Min: 4/4mil
	Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Dimension	Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
	Drilling Diameter	≧0.25mm
	Hole Diameter Tolerance	±0.05mm
	Hole Position Tolerance	±0.076mm
	Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
PTH+Panel Plating	Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Outer Layer	Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
EING/Flash Gold	Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask	Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Finger	Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
	Slot Size	Min:0.4mm
	Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Punching	Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
	Angle	15°30°45°
	Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30～300mm
Test	Testing Voltage	250V
Test	Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration		12:1
Laser Drilling Size		4mil(0.1mm)

FR4 CEM-1 1.6 mm PCB Board Layout HASL Finished UL RoHs OEM Service Images

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